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SMT
T8200 Pro Series
T8200 Pro Series
Triertech T8200 Pro,3D AOI technology utilizing four side-mounted camera arrays integrated with a Moiré fringe illumination system for image-based 3D modeling in SMT applications，the leading AOI syste...
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LX9200
LX9200
LX9200 is a 3D online automatic monitoring equipment, which is based on micron X-ray source, 3D/CT imaging, tomography and other technologies, using a closed microfocal X-ray source, coupled with high...
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Quadra7
Quadra7
Quadra7 is an X-ray inspection and fault analysis tool for use in a wide range of industries including electronic packaging and wafer manufacturing, product inspection such as automotive electronics, ...
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Assembly test
T6000
T6000
The Triertech T6000 is designed for the inspection from the top / bot side with an FOV of 300mm x 400 mm/420mm x 530mm. It has one multi-LED illuminated line scan unit as well as the patented special ...
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T7000
T7000
Triertech-T7000-PIN series is a multi function pin inspection system, equipped with advanced vision module and intelligent algorithm, which can cover most of Pin type inspection.
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T7300
T7300
The Triertech T7300 is an inspection device tailored for the Pressfit process.Given the current situation where the actual condition of PIN pins inside holes cannot be seen with the naked eye and ordi...
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ICT/FCT
MTS 300
MTS 300
In-Circuit Test System with Vacuum Interface，The MTS 300 is multifunctional. It offers a lot of space for modules and functions, with a small footprint
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MTS 30
MTS 30
19 inch In-Circuit Test System，The Sparrow offers maximum flexibility and test capability in a small footprint
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MTS 505
MTS 505
Flying Probe Test System,The Condor can combine different test methods and can therefore be used universally for all test strategies
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Semiconductor
Wafer-level 2D+3D metrology inspection equipment
Wafer-level 2D+3D metrology inspection equipment
Applicable for die surface defect inspection, dicing street defect inspection, RDL defect inspection before/after wafer dicing in advanced semiconductor packaging, as well as bump height and coplanari...
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Post-dicing wafer defect
Post-dicing wafer defect
The equipment is applicable for post-dicing chip edge chipping, cracks, scratches, and surface contamination/residual glue detection in advanced semiconductor packaging.Deep learning AI algorithmDeep ...
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High-precision 2D+3D AOI
High-precision 2D+3D AOI
The equipment is applicable for post-packaging inspection of die surface defects after Die Bond and Wire Bond processes in semiconductor back-end assembly, as well as solder joint and gold wire defect...
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