
The equipment is applicable for post-dicing chip edge chipping, cracks, scratches, and surface contamination/residual glue detection in advanced semiconductor packaging.
Deep learning AI algorithm
Deep learning algorithms enable neural networks to automatically learn features and extract information from massive data through training, performing intelligent analysis on image or video data. The current software integrates five universal algorithms based on CNN and Transformer architectures: classification, segmentation, object detection, character recognition, and unsupervised learning (good product learning). These algorithms demonstrate significant effectiveness in practical applications such as defect recognition in complex environments, component classification, and character reading scenarios. With deeper research, we have not only refined existing model architectures to reduce parameter quantities but also leveraged NVIDIA's efficient deep learning inference engines to implement computational graph optimization, accuracy improvement, layer simplification, multithreading, and batch inference processing. These enhancements have substantially improved model inference speed and efficiency.

· Wafer dicing street chipping, cracks, and die surface contamination/debris detection
- Supports bright field, dark field, Photolumination, and transmission illumination modes
- Employs industry-leading AI 2.0 detection algorithms
ADC automatic classification
- AI detection + ADC automatic classification positive feedback mechanism effectively reduces overkill rate
· Custom development through deep collaborations with major research institutes and enterprises

· Camera configuration: Ultra-high-speed, high-precision, large-format, low-noise industrial camera + IR camera
· Lighting configuration: Ultra-high-power bright/dark field white light + IR illumination system
· Lens configuration: 2X, 3.5X, 5X, 10X (customizable per client requirements)
· Detection resolution: Detectable defects 4.5μm/3μm/2μm/1μm
· Repeatability & Reproducibility: ≥99.5%
· Detection rate: Underkill=0, Overkill≤0.5%
· 8-inch Wafer WPH: Includes wafer loading, alignment, and inspection time
· WPH=108@2X, WPH=65@3.5X, WPH=40@5X, WPH=10@10X
· Equipment uptime: ≥97% [(Total time - Downtime)/Total time ×100%]