Applicable for die surface defect inspection, dicing street defect inspection, RDL defect inspection before/after wafer dicing in advanced semiconductor packaging, as well as bump height and coplanari...

The equipment is applicable for post-dicing chip edge chipping, cracks, scratches, and surface contamination/residual glue detection in advanced semiconductor packaging.Deep learning AI algorithmDeep ...

The equipment is applicable for post-packaging inspection of die surface defects after Die Bond and Wire Bond processes in semiconductor back-end assembly, as well as solder joint and gold wire defect...

The equipment is applicable for micro-assembly Die Bond and Wire Bond post-process die surface defect inspection, as well as solder joint and gold wire defect detection after gold wire bonding.Deep le...

The equipment is applicable for surface defect inspection of chips/DBC/trenches after Die Bond and Wire Bond processes in power semiconductor packaging and testing, as well as solder joint and aluminu...

Applicable for AOI visual inspection in SIP packaging process stages, particularly effective for detecting surface foreign matter, scratches, lifted leads, and floating height on chips.Deep learning A...