T8600 series
The Triertech T8600 is a high-performance, double-sided inline/add-on soldering AOI system that integrates cutting-edge 3D and AI technologies. Utilizing high-precision 3D measurement for double-sided solder joint inspection, it combines FOV positioning with self-programming AI algorithms to achieve exceptional defect detection accuracy.
Product features
3D + AI Dual-Sided DIP/Through-Hole Solder Inspection AOI
Simultaneous Top & Bottom PCB Inspection: Streamlines production workflows while reducing shop-floor footprint and labor costs.
AI-Powered Auto-Programming: Combines pad and FOV positioning with AI algorithms to simplify and accelerate setup workflows.
Synchronized Dual-Camera Imaging: Features asynchronous interlocked capture to eliminate optical interference from opposing illumination.
Enterprise SPC Analytics: Integrated software delivers comprehensive and precise data analytics for continuous yield improvement.
Product specifications
