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The Triertech T8000 3D SPI delivers true 3D inspection. Featuring a 2-way small-angle projection system to minimize optical shadowing on tight-pitch components, it utilizes a breakthrough Moiré fringe algorithm to further reduce cycle time.

The T8200 delivers single-pass 3D + AI inspection across all defect types. Featuring a 4-path small-angle projection system, it significantly eliminates shadowing on tight-pitch components. Powered by a breakthrough Moiré fringe algorithm, it further reduces cycle time (CT)—solving long-standing industry bottlenecks to drive yield rates to new heights.

The Triertech T8200 Pro is an internationally leading 3D AOI system powered by an advanced imaging array—featuring four side-view cameras combined with Moiré fringe projection for high-precision 3D modeling. Driven by a powerful 3D + AI architecture, the T8200 Pro delivers exceptional, comprehensive defect detection in a single pass, significantly boosting inspection efficiency and yield rates across SMT production lines.

The Triertech T8600 is a high-performance, double-sided inline/add-on soldering AOI system that integrates cutting-edge 3D and AI technologies. Utilizing high-precision 3D measurement for double-sided solder joint inspection, it combines FOV positioning with self-programming AI algorithms to achieve exceptional defect detection accuracy.

Triertech T8800: An exceptional dual-sided final inspection AOI, powered by industry-exclusive AI vision technology for high-precision defect capture.

The LX9200 is an advanced 3D inline automated inspection system driven by micron-level X-ray sources, 3D/CT imaging, and computed tomography technologies. Featuring a closed microfocus X-ray source paired with a high-definition Flat Panel Detector (FPD), it generates stable, superior-quality X-ray imaging—delivering a dependable foundation for high-precision inspection.